Base materials: high temperature FR4/FR5, free halogen FR4, aluminum based, polyimide, rogers, arlon, other Teflon and PTFE
Layers: 1 to 30 layers standard PCB, blind via and buried via board
Minimum track space: 4/4mil, 3mil partial allowed
Maximum size: 1,000 x 1,200mm
Minimum size: 3 x 3mm
Surface copper thickness:
Maximum: 6/6 ounce
Minimum: 0.5/0.5 ounce
Hard gold thickness: maximum: 50 U
Maximum board thickness: 6.0mm
Finishes: SMOBC/HASL, lead-free SMOBC/HASL, organic OSP, hard and soft gold, plating tin, immersion silver, immersion tin and electroless nickel/immersion gold
Payment Details:
Payment Terms:
T/T
Product Certifications:
Certificate Standard:
UL
Certificate Number:
E302752 Click above link to view certificate details in third-party database.
