ABP (Shenzhen) Electronics Limited

OEM/ODM

PCB Assembly/AV Machines LED OEM Capability "1-30 layers standard PCB, Blind Vias and Buried Vias Board. Minimum Track Space:4mil /4 mil,3mils partial allowed; Minimum Annular Ring:3 mils for via hole 6mils for component hole. ＊Board Thicknes:0.2mm-6.0mm, Technique: HAL, HASL (lead free), immersion gold, Immersion Tin, Plated Tin, Immersion Silver, OSP, Flux, flash gold Plating thickness(u”): Electrical gold: NI:100-600u"",Hard Gold:0.5-50u"".Immersion Gold:NI100-600u"",Gold:0.5-5u"". Copper thickness:0.5/0.5OZ-6/6OZ Size of Factory in Square Meters 15000 Factory Size in Square Feet 161458 Staff Details Production Staff: 150 to 199 QC Staff: 50 to 59 R&D Staff: 10 to 19 Design Services Offered Yes Buyer Label Offered Yes Materials/Components Materials:Fr4, Rogers, Teflon, High Temperature, Free halogen, Aluminium Based ,ISOLA Machinery/Equipment for OEM CNC Routing Machine,Hot Air Leveling,S/M Exposure Machine,S/M Pre-cleaning,Pattern Plating Line,D/F Developing Line,Desmear and Auto PTH Line,D/F Exposure Machine,Deburring Line,CNC Drilling Machine,X-ray Target,Lamination Press,AOI,ML Lay-up Line,Innerlayer Bonding,Developing & Etching Line. Monthly Output 10,000 to 19,999 Square Meter Major Markets Served Eastern Europe North America Central/South America Asia Australasia